(Artikelnr: FITLET3-CX6211-S-W210M )
Barebone fitlet3-CX6211-S-W210M  with Atom x6211E (2C, 1.3GHz, 6W),  Terminal block w/ RS-232, RS-485, GPIOs and M.2 module Intel AX210 WiFi/BT
 

Specifications

RAM Up to 32 GB 1x SO-DIMM 204-pin DDR4 Non-ECC DDR4-3200MT/S
STORAGE M.2 Key-M accepts SATA of NVME modules, 2230, 2242, 2260 or 2280
DISPLAY mini DP 1.2 | DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode
HDMI 1.4b | HDMI 1.4b (up to 3840 x 2160 @ 30Hz)
LAN 2x Gigabit on-board Ethernet ports on RJ45 (2x Intel® i210 1000 Mbps / 100 Mbps / 10 Mbps)
LAN- Up to 4x Gbit Ethernet Intel I210 (via optional FLAN card)

Additional 2x GbE LAN on RJ45 on FC3-LAN FACET Card

Additional 1x GbE LAN on SFP+ for optical LAN on FC3-OPLN FACET Card
Additional 1x GbE LAN on RJ45 with PoE device capabilities on FC3-POED FACET Card
WIRELESS M.2 Key-E
1 Optional On-board module with Wi-Fi 6E, BT 5.2, for M.2 2230 module with Wi-Fi 6E, BT 5.2
CELLULAR LTE/WCDMA/GSM/GNSS
M.2 Key-B
Available using M.2 Key-B socket on a fitlet3 SBC for M.2, LTE/5G modem, with micro-SIM tray. fitlet3 SBC is equipped by micro-SIM socket.
I/O USB 6 on-board ports (2x USB 3.0 + 4x USB 2.0)
Audio (*optional) provided upon request Optional analog output, analog input on 3.5 mm jacks
HDMI & DP audio
  Isolated serial and GPIO, up to 24V, on terminal block
Optional isolated RS-232/422/485
2x isolated GPI + 2x isolated GPO
BIOS AMI Aptio
POWER Input voltage 7-342V DC / 5-25Watt - reverse polarity protected
OS SUPPORT Windows 10 Pro
Windows 10 LTSC 2021 IoT Enterprise
Windows 11 Pro
Linux Mint
Compatible with other Windows 10 /11 variants.
Compatible with other Linux variants.
Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD)
DIMENSIONS Standard housing: 132.8 mm X 100 mm X 34.8 mm
Industrial housing: 140 mm X 111 mm X 34.8 mm
Unit Weight 420Gr 
HOUSING/COOLING All metal housing
Aluminium zinc die cast parts
Fanless convection cooling through the housing,  no vents
ENVIRONMENT Operating temperature range -Up to -40°C to 85°C*
Relative humidity -5% – 95% non-condensing
SHOCK&VIBRATION MIL STD 810G compliant

Vibration test: IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-64 (up to 2 KHz , 3 axis)
Shock test: IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-27 (15g , 6 directions)




Available FACET-Cards
FC3-FLAN 2x Dual Lan 1Gbit Fitlet2 internal facet card
FC3-FPOE 1x 1Gbit LAN with POE (power to fitlet3)
FC3-FSFP 1x SFP 1Gbit LAN adapter
   
   
   


FACET Card interface includes 2x PCIe, USB, eDP 1.3 and I2C.

Mounting options
VESA / wall mounting bracket*
DIN-rail mounting bracket*

* = Optional
Fotos:
Optionen
Felder mit * sind Pflichtfelder